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Japan silicon edge grinding equipment

Update date: Apr 20

silicon, ingots, are sliced into wafers, ground to a specific thickness (e.g., 300 mm diameter wafers are 0.775 mm thick) and polished to be smooth. A thin layer of epitaxial (i.e., single crystal) silicon, or “epi”, is deposited using CVD and the wafer is ready for use in a fabrication facility (commonly called a fab). All the transistors

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  • Grinding Machines - Products | Komatsu NTC Ltd
    Grinding Machines - Products | Komatsu NTC Ltd

    Fukuno Plant. 641 Nojiri, Nanto City, Toyama 939-1502, Japan Tel +81-763-22-2165 Fax +81-763-22-6218

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  • Semiconductor Manufacturing Equipment
    Semiconductor Manufacturing Equipment

    Wafer Edge Grinding Machine Highly accurate wafer edge grinding Machine for φ50 mm to 200 mm, 300 mm, and 450 mm wafer production. It is used in production lines of all over the world

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  • Okamoto Machine Tool Works,Ltd
    Okamoto Machine Tool Works,Ltd

    [ Head Office / Annaka factory ] 2993 Gobara,Annaka,Gunma,379-0315 JAPAN. TEL:027-385-5800 FAX:027-385-5880

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  • Japanese firm bets on 3D packaging as key to next-gen chip
    Japanese firm bets on 3D packaging as key to next-gen chip

    Jun 30, 2021 Sekiya’s grandfather founded the company in 1937 to cash in on demand for grinding equipment amid Japan’s pre-war military build-up. After the war, Disco’s abrasive wheels found use in

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  • Fujimi Corporation
    Fujimi Corporation

    COMPOL - Silicon and Exotic Material Polish. COMPOL is a colloidal silica slurry developed especially for polishing metals, ceramics, and electronic substrates such as lithium tantalate (LiTaO3), lithium niobate (LiNbO3), and sapphire. Read More

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  • Introduction to Semico nductor Manufacturing and FA
    Introduction to Semico nductor Manufacturing and FA

    Oct 06, 2017 • Silicon is the seventh-most abundant element in the universe ... and Grinding 5. Slicing 6. Edge Rounding 7. Lapping 8. Etching(Chemical Polishing) 9. Polishing 10. Cleaning 11. Inspection 12. Packing / Shipping ... Test Equipment Bin 1: Good Quality Devices

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  • Bulletin of the Japan Society of Precision Engineering
    Bulletin of the Japan Society of Precision Engineering

    This paper presents a new grinding method in which a silicon wafer rotating at high speed is ground by a cup wheel that is fed inward continuously. The paper compares experimental results by this

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  • Grinding and Polishing Guide | Buehler
    Grinding and Polishing Guide | Buehler

    Grinding and Polishing Guide. Grinding should commence with the finest grit size that will establish an initially flat surface and remove the effects of sectioning within a few minutes. An abrasive grit size of 180-240 [P180-P280] is coarse enough to use on specimen surfaces sectioned by an abrasive wheel. Hack-sawed, bandsawed, or other rough

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  • Glass Grinding Machine on sales - Quality Glass Grinding
    Glass Grinding Machine on sales - Quality Glass Grinding

    Auto Solar Panel Making Machine PV Module Glass Edge Grinding Machine Specifications: Model YEPC6M1300 YEPC6M1600 YEPC6M2000 YEPC6M2500 Max. Width of Glass 1300mm 1600mm 2000mm 2500mm Min. Size of Glass 120

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  • US5658189A - Grinding apparatus for wafer edge - Google
    US5658189A - Grinding apparatus for wafer edge - Google

    US5658189A US08/527,348 US52734895A US5658189A US 5658189 A US5658189 A US 5658189A US 52734895 A US52734895 A US 52734895A US 5658189 A US5658189 A US 5658189A Authority US United States Prior art keywords wafer grinding polishing grinding wheel edge Prior art date 1994-09-29 Legal status (The legal status is an assumption and is not a legal conclusion

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  • US8309464B2 - Methods for etching the edge of a silicon
    US8309464B2 - Methods for etching the edge of a silicon

    US8309464B2 US12/415,551 US41555109A US8309464B2 US 8309464 B2 US8309464 B2 US 8309464B2 US 41555109 A US41555109 A US 41555109A US 8309464 B2 US8309464 B2 US 8309464B2 Authority US United States Prior art keywords wafer edge peripheral edge etchant point Prior art date 2008-03-31 Legal status (The legal status is an assumption and is not a legal conclusion

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  • Grinding Consumables – Spectrographic Ltd
    Grinding Consumables – Spectrographic Ltd

    Grinding Consumables. Metallurgical grinding papers in diameters and strips for metallurgical grinders 200mm, 230mm, 250mm, 300mm, 305mm and 400mm. Grit sizes available from P60 to P4000 - Zirconium Oxide - Aluminium Oxide - Silicon Carbide. Silicon Carbide (BLACK) - for use with all metals - NA - Non Adhesive PSA - Self adhesive - sticky backed

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  • Die Prep Process Overview – Wafer Dies: Microelectronic
    Die Prep Process Overview – Wafer Dies: Microelectronic

    Aug 30, 2020 Grinding wheels : In general, grinding typically involves Z1 & Z2 grinding wheels where Z1 is coarse grinding ( #500 grit grinding wheel) and removes most of the Silicon (~ 500 – 600um). Z2 grinding is a fine grinding process ( typically #3000 grit grinding wheel, but can be little finer) and removes about 20-50um of Silicon

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  • Edge Grinder for wafer edge solution. Improves quality
    Edge Grinder for wafer edge solution. Improves quality

    The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials

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  • Semiconductor Manufacturing
    Semiconductor Manufacturing

    Wafer Edge Grinding Machine Highly accurate wafer edge grinding Machine for φ50 mm to 200 mm, 300 mm, and 450 mm wafer production. It is used in production lines of all over the world

    Get Price
  • High Precision Polishing Service by the number one
    High Precision Polishing Service by the number one

    Polishing-affiliated process such as laser marking, edge-grinding, glass cutting, dicing, chamfering, metal vapor deposition, etc. are also offered with high precision. Surface processing technology such as epitaxial growth, etching, etc. are also materialized in our process with highly sophisticated level

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  • Silicon Wafer Production Process | GlobalWafers Japan
    Silicon Wafer Production Process | GlobalWafers Japan

    In small diamter wafering process, wafers are sliced one by one from the ingot using a rotating diamond inner peripheral blade. The image shown on left is slicing with wire-saw. Beveling (Peripheral Rounding) The periphery of a wafer is ground with a diamond tool to attain the required product diameter

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  • Eighty-Year-Old Japanese Firm May Be Key to Next
    Eighty-Year-Old Japanese Firm May Be Key to Next

    Jun 29, 2021 (Bloomberg) -- One Japanese company that got its start making grinding wheels for machinery more than 80 years ago believes it holds the key to helping manufacturers create ever slimmer and more powerful semiconductors to power next-generation

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  • 10 Best Japanese Kitchen Gadgets 2021 - Best
    10 Best Japanese Kitchen Gadgets 2021 - Best

    Jan 28, 2021 Best Japanese Kitchen Gadgets for Mixing and Grinding. Japanese Suribachi and Surikogi, or mortar and pestle, is an indispensable part of the kitchen. It is used in a variety of ways, for recipes that involve grinding and mixing. In Japan, Suribachi and Surikogi are most commonly used to grind sesame seeds

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  • SiC Wafer Grinding - Engis
    SiC Wafer Grinding - Engis

    Grinding; Lapping (1 or 2 steps) Polish and Chemical-Mechanical Polishing (CMP) Silicon Carbide Wafer Grinding. The EVG-250/300 series Vertical Grinding Machine combined with Engis MAD Grinding Wheels can achieve a superior surface finish on silicon carbide wafers to reduce or even eliminate loose abrasive lapping steps

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  • Grinding and Polishing - ASM International
    Grinding and Polishing - ASM International

    tomatic grinding, which could be important when the cross section at a specific depth is of interest. Automatic equipment is much more expensive than manual machines. Diamond abrasives are recommended for grinding most ceramics, but silicon carbide (SiC) paper and cubic boron nitride (CBN) platens can also be used

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